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- 1 - TS12001 version 1.3 specifications subject to change www.triunesystems.com copyright ? 2012 , triune systems, llc nanosmart? battery management under - v oltage load switch description features ? off - a ctive? feature with ultra - low pico - amp current ? best - in - class o ff - active ? quiescent current of 100pa ? ultra - low on - active quiescent current of 70na ? accurate on to off - active? v oltage threshold ? threshold voltage option s of 1.2 v - 4.2v in 100mv steps (programmed at manufacturing) ? supervisory over - current limit shutdown ? low rds(on): 175m? typical @ 5v ? low drop out disconnect from vbat to loads ? turn - on slew rate controlled ? 500mv off to on - active hysteresis summary specifications ? wide input voltage range: 1.2v C 5.5v ? package d in a 8pin dfn (2x2) block diagram the TS12001 off - active ? b attery management load s witch is used to protect a battery from excessive discharge. it consists of an internally generated threshold voltage (v thresh ) , comparator with hysteresis, slew rate control for the load switch, a p - channel load switch, and a n o pen - drain indicator pin. when the input battery v olta ge is above v thresh , the load switch is o n - a ctive. when the input battery v oltage falls to v thresh , the l oad s witch is off - active ? and the quiescent cu rrent draw is approximately 10 0pa. applications ? p ortable battery ? industrial ? medical ? smartcard ? rfid ? energy harvesting systems g n d r e g u la te d t h r e s h o ld v o u t n p g v c c
- 2 - specifications subject to change www.triunesystems.com copyright ? 2012 , triune systems, llc TS12001 version 1.3 typical applications note: when the TS12001 is off - ac tive ?, the battery will continue to charge through the body diode between vout and vcc. c h a r g e r l o a d d i s c o n n e c t t h e b a t t e r y t s 1 2 0 0 1 g n d v o u t n p g v c c c b y p c h a r g e r l o a d d i s c o n n e c t t h e l o a d t s 1 2 0 0 1 g n d v o u t n p g v c c c b y p
- 3 - specifications subject to change www.triunesystems.com copyright ? 2012 , triune systems, llc TS12001 version 1.3 pin - out configuration pin # name i/o/p description 1 gnd p gnd 2 v out o output to system load 3 nc no connect (connect to gnd or f loat) 4 nc no connect (connect to gnd or float) 5 nc no connect (connect to gnd or float) 6 v cc i/p supply input 7 v cc i/p supply input 8 npg o open - drain n - channel output (low indicates power good) absolute maximum rat ings over operating free C ai r temperature range unless otherwise noted (1 ,2 ,3 ) pin / parameter value unit v cc , v out , n pg - 0.3 to 6.0 v electrostatic discharge C human body model 2 k v operating j unction t emperature r ange, t j - 20 to 85 ? c storage t emperature r ange, t stg - 65 to 150 ? c lead temperature (soldering, 10 seconds) 260 ? c note 1: stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are str ess ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute C maximum C rated conditions for extended periods may affect device reliability. note 2: all voltage values are with respect to network ground termi nal. note 3: esd testing is performed according to the respective jesd22 jedec standard. thermal characterist ics package dfn ? ja ( ? c/w) (see note 4 ) ? jc ( ? c/w) (see note 5 ) 8 pin 73.1 10.7 note 4 : this assumes a fr4 board only. note 5 : this assum es a 1 oz. copper jedec standard board with thermal vias C see exposed pad section and application note for more information.
- 4 - specifications subject to change www.triunesystems.com copyright ? 2012 , triune systems, llc TS12001 version 1.3 recommended operatin g conditions parameter min typ max unit unregulated supply input voltage (v cc ) 1.2 5.5 v operating ambien t temperature, t a (note 6 ) - 20 55 c operating junction temperature, t j - 20 85 c input bypass capacitor (c byp ) 100 n f note 6 : t a max shown here is a guideline. higher t a can be tolerated if t j does not exceed the absolute maximum rating. characte ristics electrical characteristics, v cc = 1. 2 v to 5 .5 v, t j = 25c , unless otherwise noted symbol parameter condition min typ max unit input supply v cc input supply voltage 1. 2 5 .5 v i q - on quiescent cur rent : o n - a ctive mode v cc = 5v, no load 7 0 150 n a i q - off q uiescent current: off - active ? cc < v thresh , no load 1 0 0 p a load switch i oc over c urrent shutdown v cc = 5.0v 3 a t oc over current retry period v cc = 5.0v 1.7 m s i l eak - sw output switch leakage current v cc < v thresh ; v out grounded 10 0 pa rds - on switch on resistance v cc = 5.0v 1 7 5 m ? cc = 3.3v 20 0 m ? cc = 1.8 v 3 5 0 m ? transition times t d1 transition delay: on - a ctive to o ff - active ? off = 2.0v, v cc = 3.0v ? ? d2 transition delay: o ff - active ? to on o ff = 2.0v, v cc = 1.5v ? on output turn - on rise time v cc = 2.5v, r l oad = 50 ? ? n pg output i leak - n pg output leakage v cc = 5.0v, v np g = 5.5v 100 na v ol - n pg low - level output voltage i np g = 5 ma 0.4 v off - active thresholds v off off - active ? thresh = 1.2v to 3.3v 0.95 * v thresh v thresh 1.05 * v thresh v v hys off - active? ? to o
- 5 - specifications subject to change www.triunesystems.com copyright ? 2012 , triune systems, llc TS12001 version 1.3 typical characterist ics on - active / off - active ? c haracteristics on - active switching behavior on - active / off - active ? i q off - active ? v thresh temperature performance on - active / off - active ? transition delay over current retry performance
- 6 - specifications subject to change www.triunesystems.com copyright ? 2012 , triune systems, llc TS12001 version 1.3 package mechanical d rawings
- 7 - specifications subject to change www.triunesystems.com copyright ? 2012 , triune systems, llc TS12001 version 1.3 recommended pcb land pattern
- 8 - specifications subject to change www.triunesystems.com copyright ? 2012 , triune systems, llc TS12001 version 1.3 application using a multi - layer pcb to maximize the efficiency of this package for application on a single layer or multi - layer pcb, certain guidelines must be followed when laying out this part on the pcb. the followi ng are guidelines for mounting the exposed pad ic on a multi - layer pcb with ground a plane . jedec standard fr4 pcb cross - section: multi - layer board (cross - sectional view) in a multi - layer board application, the thermal vias are the primary method of he at transfer from the package thermal pad to the internal ground plane. the efficiency of this method depends on several factors, including die area, number of thermal v ias, thickness of copper, etc. package thermal pad solder pad (land pattern) thermal via's package outline package and pcb land configuration for a multi-layer pcb ( square ) package solder pad package solder pad ( bottom trace ) thermal via component traces thermal isolation power plane only 1 . 5748 mm 0 . 0 - 0 . 071 mm board base & bottom pad 0 . 5246 - 0 . 5606 mm power plane ( 1 oz cu ) 1 . 0142 - 1 . 0502 mm ground plane ( 1 oz cu ) 1 . 5038 - 1 . 5748 mm component trace ( 2 oz cu ) 2 plane 4 plane
- 9 - specifications subject to change www.triunesystems.com copyright ? 2012 , triune systems, llc TS12001 version 1.3 the above drawing is a represent ation of how the heat can be conducted away from the die using an exposed pad package. each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. the output c urrent rating for the linear regulators may have to be de - rated for ambient temperatures above 85c. the de - rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. application using a single layer pcb layout recommendations for a single layer pcb: utilize as much copper area for power management. in a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachmen t method (solder paste or thermal conductive epoxy). in both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. important: if the attachment method is not implemented correctly, the functional ity of the product is not guaranteed. power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. mold compound die epoxy die attach exposed pad solder thermal vias with cu plating single layer , 2 oz cu ground layer , 1 oz cu signal layer , 1 oz cu bottom layer , 2 oz cu 20 % cu coverage 90 % cu coverage 5 % - 10 % cu coverage note : not to scale use as much copper area as possible for heat spread package thermal pad package outline
- 10 - specifications subject to change www.triunesystems.com copyright ? 2012 , triune systems, llc TS12001 version 1.3 ordering information TS12001 - c vvv d fnr vvv threshold voltage (v thresh ) * 017 1.7 v 021 2.1 v 023 2.3 v 024 2.4 v 025 2.5 v 026 2.6 v 028 2.8 v 030 3.0 v * custom values also available (1.2v - 4.2v typical in 100mv increments)
- 11 - specifications subject to change www.triunesystems.com copyright ? 2012 , triune systems, llc TS12001 version 1.3 legal notices information contained in this publication regarding device applications and the like is provided on ly for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. typical parameters whic h may be provided in triune systems data sheets and/or specifications can and do v ary in different applications and actual performance may vary over time. all operating parameters, including typicals must be validated for your application by your technical experts. triune systems makes no r epresentations or warranties of any kind wh ether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose. triune systems disclaims all liability arising from thi s information and its use. triune system products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to su pport or sustain life, or for any other applicatio n in which the failure of the triune systems product could create a situation where personal injury or death may occur. shoul d the buyer purchase or use triune systems products for any such unintended or unauthorized application, the buyer shall indemnify and hold triune systems, and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expe nses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that triune systems was negligent regarding the design or manufacture of the part. no licenses are conveyed, implici tly or otherwise, under any triune systems intellect ual property rights. trademarks the triune systems? name and logo, mppt - lite?, off - active?, and nanosmart? are trademarks of triune systems, llc. in the u.s.a.. all other trademarks mentioned herein are property of their respective companies. ? 2012 tr iune systems, llc. all rights reserved.

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